Arud Selvan`s CV
+1-657 445 9859
Arud Selvan Sundaramurthy
Senior System Architect
CA, USA
+1-657 445 9859 – arudselvan@yahoo.com
Professional Profile
· 17+ years of professional Software Architect, Design and Development experience
mainly in Next Generation Charging Systems (BSSF), VoIP, AAA products and in
Telecom 2G/3G/LTE(CCN/OCC) charging gateway products and VoLTE, with MTAS as
AS.
· Currently working for DAT(Design Architect Team) for Next Generation Charging
Systems (BSSF) for Telecom BSS Systems.
· Involved in solution design for the Product Customization for T-Mobile customers in
CBiO Solution.
· Involved in solving Customer's Hot Escalations in CCN for operators like MTN SouthAfrica
& SINGTEL-SINGAPORE.
· Involved in OCC Transfer project from SWEDEN to INDIA, for System Architect role.
· Have good knowledge in LTE-Data charging/Policy-Control/ Gy / Gx/ Rf/ Ro-Diameter
interface & AAA-Diameter protocol.
· Individual contributor towards design & development of protocol stacks viz. Diameter
Base Protocol, STUN,RTP-RELAY and MGCP.
· Possess very good working experience Linux, CISCO- IOS, Distributed OS(DICOS),
Embedded OS(VxWorks).
· Possess very good programming skills in C – around 10 years.
· Possess very good in Software Design & Architecture – around 10 Years.
· Has good knowledge in JAVA – around 1 year.
· Has good understanding of OSGi, REST.
· Has good understanding of networking technologies like SDN and NFV.
· Have contributed for DRA(ie. Diameter Routing Agent) proposal.
· Have good working experience in the following fields
Ø Ericcson Charging System product viz CCN (Charging Control Node)-Charging
Gateway for UMTS/LTE.
Ø Contributed to Ericsson Policy Control Framework design for Mobile Broadband
Charging.
Ø AAA protocols like Diameter and its applications like Credit Control application, Rf,
Ro, Gy, Gx and S6B diameter interfaces.
Ø Cisco PDN Gateway, mainly in diameter interfaces (S6B).
Ø VOIP protocol design & development (SIP, MGCP, STUN, RTP, RTCP, SDP)
Ø Embedded systems (Set Top Box, ATA, Sandpoint Board, Windows PDA & PDNGW)
Ø
Carrier grade systems like Ericsson TSP (Telecom Server platform)-a clustered
platform.
Ø Networking technologies – TCP/IP, socket programming
Ø Linux multi-threaded architecture (pThreads), Linux IPC and Linux Sockets,
Linux SMP (Multi-core Processors) systems.
Ø Tornado II, Clear Case, CVS, GDB, MAKE, LINT, cscope, source insight, Visual
Studio,eclipse
· Have worked in the client location (Dallas-USA) for the customer Samsung
Telecommunications America.
· Have worked for HCL’s major clients like CISCO, PLUSTEK, AGERE SYSTEMS.
· Have good exposure to Agile Methodology and Waterfall model.
· Certifications – TMFORUM-Information Framework Foundation Level
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· Bachelors of Technology in Computer Science & Engineering – Pondicherry
Engineering College - 1995-1999
Innovation Summary
BUSS Innovation Competition
IvD
International Paper Submit-SDWN-2015
One of Three Finalist in IoT Category
3 IvDs Filed (Invention Disclosures Areas
SDN & NFV & Policy)
Presented Technical paper in International
Conference SDWN-2015 @ Italy
US Visa Details
Work Visa
L2 (Dependent Visa) -EAD Applied
Experience Summary
Total Years of Experience
Organization
Ericsson India Private Ltd(R&D).
HCL Technologies Ltd.-Chennai
16 Yrs 3 Months
Period
September-2009 – May 2016
August-2000 – August - 2009
High Gate World Wide & Co.- Pondicherry July-1999 – July-2000
Education Profile
Highest Degree
College
University
Class
Year of Passing
B.TECH – CSE
Pondicherry Engineering College
Pondicherry University
I Class
1999
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Brief Summary of the Projects
Project Details (In reverse chronological order)
PROJECT # 1
NAME / TITLE
ROLES AND RESPONSIBILITIES
BSS Systems (CHA PAC)
1. Senior System Architect
2. DAT member/DAT-PO
3. SME(Subject Matter Expert) role for the team.
4. DAT-PO for the BUC for CHA GUI
5. Individually contributed in writing requirements
specification document and solution description
document.
6. Involved in Architecture and high level design.
7. Product Owner, took end to end responsibility of
features in CHA PAC from requirements (BUC
study) , solution design(BSUC study), software
design(Implementation Proposal)and testing(Test
analysis).
DESCRIPTION
· CHA PAC acts as Charging gateway for 2/3/4/G
networks. CHA PAC is designed for next
generation OSS/BSS systems which will be
deployed in Cloud and Virtual Systems. It is
designed as OSGi modules and runs on Apache
Karaf container.
· Designed Diameter Load Balancer for Charging
System.
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PROJECT # 2
NAME / TITLE
ROLES AND RESPONSIBILITIES
CCN/OCC/BSS – Charging Control Node/Online Credit
Control
1. Sub-System Architect
2. Individual Contributor(IC)
3. SME(Subject Matter Expert) role for the team.
DESCRIPTION
CCN/OCC acts as Charging gateway for 2/3G/LTE
networks.
· Currently doing Architect role for OCC and PC
Tech for OCC
· Involved in Bx/SingleSignOn/OnLine Charging
Study for BSSF Architecture.
· Involved in PC solution design for TMobile/WIND/MoviStar
customers.
· Doing PO(Product Owner) role, for
MBC(Mobile Broadband Charging) and
VoLTE & Master Key PMR for CCN
· Developed Gx interface for Mobile Broadband
Charging
· Technical contribution to Policy Control
Framework Design.
· Product Sustenance –Product customizations &
Trouble report fixing.
· Involved in DRA proposal.
· Sentinel License Framework Design and
development in CCN.
· Contributed to Node Improvement ProgramProposed
ideas for CCN/OCC improvement.
· Number Normalization framework design and
development in CCN.
PROJECT # 3
NAME / TITLE
ROLES AND RESPONSIBILITIES
S6B & RF DIAMETER INTERFACE DESIGN FOR PDNGW
1.
Technical Specialist.
2. Design and development of S6B and Rf diameter
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interface for Cisco IOS.
3. Technical guidance for the team for the development
of unit test plan and diameter server simulator part.
DESCRIPTION
· Design and development of Diameter applications
like S6b and Rf for PDN-GW. The S6b interface
provides the authorization functionalities when UE
attaches to the EPC using PMIPv6 mode. The Rf
interface provides the offline charging
functionalities for the PDN-GW. This project also
involves the design and development of diameter
server simulator part for S6b and Rf.
· Design and development of Diameter stack based
on the RFC 3588 and 3539, which is AAA
protocol used for Authentication, Authorization
and Accounting.
PROJECT # 4
NAME / TITLE
ROLES AND RESPONSIBILITIES
VOIP Projects (SIP/MGCP/STUN/B2BUA/RTP/RTCP)
1. Team Member.
2. Design of porting strategy for signaling part of
MGCP stack from Linux to VxWorks.
3. Setup of Build environment for MGCP stack in
Tornado II.
4. Ported the signaling part of MGCP stack to
VxWorks.
5. Development of FXO package support in MGCP
stack.
6. Development of sample application on the top of
MGCP stacks in VxWorks.
7. Development of test cases for testing the MGCP
stack and authentication support in the stack.
DESCRIPTION
· Porting of SIPSTACK to Mobile Platform which is
running on WinCE. The work includes
enhancement of RTP Stack to WinCE platform and
development of RTP payload format for DTMF
digit (RFC 2833). The work involves in design and
development of middleware architecture for
MANET. This complete work is done at Samsung
Telecommunication America.
· Design and development of Simple Traversal of
UDP through NAT ( i.e. STUN) client and
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connection –reuse draft of IETF, enhancement in
sip stack for rport support, enhancement in SDP
module for rtcp attribute support and enhancement
in VTF (Voice Test Framework) for STUN.
· Development of signaling relay component (i.e.
B2BUA) and media relay component (i.e. RTPRELAY),
which will be used for making VOIP
calls between two SIP entities (i.e. UA) when they
are separated by a Firewall. Development of Test
suites for testing the feature.Porting and sustenance
of MGCP Stack (on Media gateway) from Linux
OS for Quicknet phone Jack (analog telephone
adaptor) to VxWorks OS on to couple of customer
owned analog telephone boards (both wireless and
wired).
· Porting of RTP stack in Linux onto VxWorks
platform.
· Addition of FXO package support to MGCP
stacks.
· Addition of fax package support to MGCP stacks.
· Addition of Authentication package support to
MGCP stacks.
· Development of MGCP Test frame work for
testing MGCP signaling and authentication support
on MG.
· Design and Development of MGCP protocol stack,
as per DOCSIS (Data Over Cable Service Interface
Specifications) defined by IPCABLECOM project
group for Residential Gateway.
· This project involves in development of SIP
conformance test plan and automation of test cases.
PROJECT # 5
NAME / TITLE
ROLES AND RESPONSIBILITIES
DESCRIPTION
Porting UCLinux to Sandpoint Board
1. Team Member.
2. Porting UCLinux to PPC Board.
This project involves porting of UCLinux ( Linux for
MMU less processors) to Motorola PowerPC 755 based
“Sandpoint” motherboard and to study its performance
against normal Linux for the same board
PROJECT # 6
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NAME / TITLE
ROLES AND RESPONSIBILITIES
DESCRIPTION
Automation of Protocol Translation (in X.25 PVC)
Feature
1. Team Member.
2. Development of Test Plan.
3. Automation of Test cases.
This project involves feature testing of Protocol
Translations. The feature is X.25 PVCs are translated to
TCP and vice versa. To test this feature test plan, is
developed and the test cases are automated.
PROJECT # 7
NAME / TITLE
ROLES AND RESPONSIBILITIES
DESCRIPTION
DVB (Digital Video Broadcasting) Sustenance
1. Team member.
2. Development embedded applications
3. Development of embedded device drivers.
Design and development of user interface for on screen
displays (OSD), controlled by SETTOP boxes.
Development of data base module for SETTOP box
applications.
Development of auto tuner driver module.
Development of skew control module.
Development of Remote Control Interface module.
Development of Real-time clock and TDT module.
Porting of Diseqc (Digital Satellite and Equipment
Control) to another client project.
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